CVE-2023-33063 Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
From the CISA KEV catalogue version 2026.11.06, with Cybergen analysis. Updated 6 Nov 2026.
Should You Worry?
- CISA confirmed exploitation in the wild and added it to the Known Exploited Vulnerabilities catalogue on 5 Dec 2023.
- Rated High severity (CVSS 7.8, scored by Vendor).
- It has been in the catalogue for 1,067 days. Systems still unpatched now have almost certainly been scanned for it.
What It Is
Memory corruption in DSP Services during a remote call from HLOS to DSP.
Affected Versions
| Product | Versions |
|---|---|
| Qualcomm, Inc. Snapdragon | 315 5G IoT Modem APQ8017 AQT1000 AR8031 AR8035 AR9380 |
From the public CVE record, as supplied by the vendor. Always confirm against the vendor advisory.
What To Do Now
- 1
Find it
Search your asset inventory and external attack surface for Qualcomm Multiple Chipsets. Include cloud images, appliances and anything a supplier runs for you.
Attack Surface Management - 2
Fix it
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Vulnerability Management - 3
Hunt for compromise
If an affected system was reachable before you patched, assume it may have been hit. Check logs, new accounts, web shells and outbound connections from the date of exposure.
Incident Response - 4
Prove it is fixed
Rescan or test the system after patching. Upgrades that fail silently and forgotten secondary instances are common.
Penetration Testing
Vendor Advisories
The Compliance Clock
General guidance, not legal advice. Your obligations depend on your sector, scope and jurisdiction.
Not Sure If You Are Exposed?
Our attack surface and vulnerability teams can check your internet-facing estate for CVE-2023-33063 and every other exploited flaw on the list.